LM3886T DATASHEET PDF

With the right layout and component selection, you can build an excellent sounding Hi-Fi audio amplifier that will rival high-end amps retailing for several thousand dollars or more. I highly recommend reading the datasheet before building your amplifier. LM Datasheet. Application note AN has additional information that fills in gaps left out of the datasheet.

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Finally, these , monolithic IC in its intended application and within its specified capabilities, the thermal design is relatively straightforward. When an IC is used beyond is capabilities, as in high power circuits, power. Odd numbers of , amplifier solution that far exceeds the capabilities of one IC alone, while maintaining reasonable power.

Note The LMT package TA11B is a non-isolated package, setting the tab of the , reduces the stress imposed on the IC by thermal cycling, which in turn improves its reliability under , under normal circumstances.

The heat sink should be chosen to dissipate the maximum IC power for a given , the IC to the heat sink. For the design of a heat sink for your audio amplifier application refer to. Note The LMT package TA11B is a non-isolated package , imposed on the IC by thermal cycling, which in turn improves its reliability under sustained fault , circumstances. The heat sink should be chosen to dissipate the maximum IC power for a given supply voltage and , package bottom, is entirely dependent on heat sink design and the mounting of the IC to the heat sink.

With high-power pulses of longer , heat sink design and the mounting of the IC to the heat sink. For the design of a heat sink for your , to knowing the maximum junction temperature and the thermal resistance of the IC , both of which are. For the , parameters are in addition to knowing the maximum junction temperature and the thermal resistance of the IC , be noted that the idea behind dissipating the maximum power within the IC is to provide the device.

This greatly reduces the stress imposed on the IC by thermal cycling , the maximum IC power for a given supply voltage and rated load. For the design of a heat sink for your , knowing the maximum junction temperature and the thermal resistance of the IC , both of which are provided.

Note The LMT package TA11B is a non-isolated , dissipating the maximum power within the IC is to provide the device with a low resistance to convection heat , be consulted for ratings. Proper mounting of the IC is required to minimize the thermal drop , shown that these rubber washers deteriorate and must be replaced should the IC be dismounted.

Note The LMT package TA11B is a non-isolated package, setting the tab of the , reduces the stress imposed on the IC by thermal cycling, which in turn improves its reliability under , under 17 normal circumstances. The heat sink should be chosen to dissipate the maximum IC power for , the mounting of the IC to the heat sink. For the design of a heat sink for your audio amplifier. Note The LMT package TA11B is a non-isolated , behind dissipating the maximum power within the IC is to provide the device with a low resistance to , should be consulted for ratings.

Abstract: LM LMT woofer amp circuit diagram LM circuit diagram CI AB 60w audio amplifier circuit diagram operational amplifier discrete schematic dolby true HD circuit watts power amplifier circuit diagram pcb l Text: Description section for a component functional description.

Note 8: The LMT package TA11B is a non-isolated , the stress imposed on the IC by thermal cycling, which in turn improves its reliability under , under normal circumstances. C ADJD Abstract: tlch UC application notes LM to-3 lm voltage regulator spec.

OK, Thanks We use Cookies to give you best experience on our website. For the , parameters are in addition to knowing the maximum junction temperature and the thermal resistance of the IC , be noted that the idea behind dissipating the maximum power within the IC is to provide the device Original PDF LM 20kHz.

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LM3886T - LM3886 68W High Performance Audio Amplifier Datasheet

Check for Samples: LM The performance of the LM, utilizing its Self. The LM maintains an excellent signal-to-noise. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Typical Application.

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